WACKER recently announced that it has developed a new silane for use in the production of highly integrated memory chips and microprocessors, expanding its portfolio of specialized products for the semiconductor industry. It can be used for chemical vapor deposition in semiconductor production.
The new silane reacts with the wafer surface. An extremely thin insulating layer with a low dielectric constant is formed. In order to shield electromagnetic interference and ensure the reliable operation of highly integrated chips.
The successful development of the new silane demonstrates once again that WACKER offers high-value-added solutions tailored to the specific needs of its customers.
According to WACKER, the number of transistors and the performance of semiconductors are increasing as semiconductor components continue to get smaller. However, circuits are becoming more numerous and switching frequencies are increasing.
The performance of the latest generation of chips is limited by electromagnetic interference. New specialty silanes can react with the surface of heated ultrapure silicon wafers to form an insulating layer with a low dielectric constant. Electromagnetic interference with electrical charges can be reduced.
WACKER has succeeded in developing a silane that significantly improves the efficiency of chips for the production of highly integrated computer chips with highly complex structures,” said Thomas Koini, president of WACKER’s Silicones business unit. Such chips are increasingly needed for computing-intensive applications such as artificial intelligence, autonomous driving and cloud computing.”
For its part, WACKER says that the company, which has supplied the semiconductor industry with raw materials and additives for many years, is Europe’s largest polysilicon producer and a globally recognized leader in polysilicon technology and quality for semiconductor applications.
Currently, one out of every two chips in the world is produced with WACKER polysilicon.